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SiLM custom sensor capabilities

The layered structure of the SiLM technology supports an extensive variety of functions.  The illustration shows the partition of functions among the three layers.

 

SiLM custom sensors 

 

The SiLM structure supports choices like these:

  • Pixel sizes from 1 µm to over 25 µm with nearly100% fill factor
  • Global shuttering with shutter extinction ratios in excess of 100,000:1
  • CDS noise reduction, on-chip pixel arithmetic
  • Multiple frame acquisitions and averaging
  • Random scanning, single or multiple regions of interest, TDI
  • A to D conversion – per sensor, per column or per pixel, up to 20 bits
  • Bayer or other filter patterns, anti-reflectance coatings, fluorescent coatings
  • Post processing functions – anything that can be built in CMOS
  • Analog or digital readout, single or multiple outputs
  • Stitching for devices up to wafer scale or up to 3-side buttable devices

For a full description of the SiLM technology, please download the pdf presentation here.

 

SiLM Structure | Lumiense Main Page | SiLM Demonstation Sensor | SiLM Quantum Effciency

 


 

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